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NVMe BGA SSD Storage Chip

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NVMe BGA SSD Storage Chip


Features




    Available in a surface mount BGA291 package;
      Fully localised design;
      Flash type: pSLC/TLC;
      PE Cycle: 50000(pSLC)/3000(TLC);
      Supports TRIM/NCQ/S.M.A.R.T;
      Support HBM function

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Applications



      Embedded devices and systems;
      Industrial medical;
      Reinforced computers.
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Partial parameters




    Supply voltage: DC +3.3V / +1.2V / +1.8V ;
    Follows NVMe1.4 standard protocol;
    Operating system: Windows series, Linux, Galaxy Kirin V10, etc.




 
 
 




 
 



 
 
 


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